Specifications：

Layer count:  8

Board thickness:  1.0mm

Base materials:   FR4 S1000-2

Finished size:   290×216mm/3pcs

Surface finish:  Immersion Gold

Line width/line space:  3/3mil

Minimum hole:  0.10mm

Solder resist color:  Light blue

Cu thickness: inner layer 1/2 oz, outer layer 1 oz

 

Product name: 

Communication equipment main board

 

Characteristic：

1, blind hole design, the structure is complex, the two order HDI

Blind L1-L2, L7-L8

Buried holes L2-L3, L3-L6, L6-L7

Through hole L1-L8

2, the production process requires a number of lamination, for the precision of the press, alignment accuracy, drilling accuracy requirements;

3, the blind hole needs laser drilling, buried hole sink copper need special control;

4, the line width is small, the etching ability is very high;

5, the need for a number of times to reduce the surface of copper.