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◆ 常规制造能力 ◆
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序号No
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项目 Item
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技术能力参数 Process capability parameter
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1
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基材
Base material
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FR-4｜High Tg｜Halogen-free｜PTFE｜｜Polyimide｜Aluminum/Copper/Ceramic Based PCB｜FR-1 / CEM-1 / CEM-3 / XPC｜
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2
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印制板类型 PCB type
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PCB｜FPC｜R-FPC｜HDI｜BT
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3
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最高层次 Max layer count
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64层 / 64 Layers
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4
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最小基铜厚 Min base copper thickness
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1/3 oz （12um）
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5
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最大完成铜厚 Max finished copper thickness
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12 oz
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6
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最小线宽/间距
Min trace width/spacing
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内层InnerLayer
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2/2mil （H/H oz base copper）
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7
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外层OuterLayer
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2.5/2.5mil （H/H oz base copper）
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8
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孔到内层导体最小间距
Min spacing between hole to inner layer conductor
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6mil
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9
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孔到外层导体最小间距
Min spacing between hole to outer layer conductor
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6mil
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10
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最小过孔焊环 Min annular ring for via
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3mil
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11
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最小元件孔焊环 Min annular ring for component hole
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5mil
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12
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最小BGA焊盘/Min BGA diameter
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8mil
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13
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最小BGA Pitch / Min BGA pitch
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0.4mm
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14
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最小成品孔径 / Min hole size
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0.15mm（CNC）｜0.1mm（Laser）
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15
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最大板厚孔径比 Max aspect ratios
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20:1
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16
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最小阻焊桥宽 Min soldermask bridge width
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3mil
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17
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阻焊/线路加工方式 Soldermask / Circuit processing method
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菲林｜激光直接成像
Film｜LDI
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18
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最小绝缘层厚
Min thickness for insulating layer
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2mil
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19
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HDI 及 特种板（Special Type PCB）
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HDI（1-5 steps）｜R-FPC（2-20layers）｜High frequency mix-pressing（2-14 layers）｜Buried capacitance & resistance …
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20
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表面处理类型
Surface treatment type
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化学沉金｜有铅/无铅喷锡｜OSP｜沉锡｜沉银｜镀厚金｜镀银
ENIG｜HAL｜HAL lead free｜OSP｜Immersion Sn｜Immersion silver｜Plating hard gold｜Plating silver
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21
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多层板最大加工尺寸/Max PCB size
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1200 × 650mm (FR4 & Aluminum LED Long Board for 1~2L PCB Max Size: 1500×500mm)
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