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Blind&Buried holes / Microvia PCB


Second-order Staggered Blind Holes, HDI
Brand: Type:HDI (High Density PCB) Model: HDI-P6I1700010A0 Release Date: 2025-05-19
Applicable industries:

Allegro, Fast Kind

1. Business Overview
 
 ● Since the beginning of 1992, Kingford Electronics has provided Allegro and Quick sample service for customers and actively supported the development of new products for customers.
    Equipped with Allegro, fast special equipment (exposure machine, lamination machine, drilling machine, etc.).
 ● has a small batch, multiple batches of flexible sample production management system.
 ● To meet customer needs of various products and specialty products and services 
(high-frequency, high-frequency mixed pressure, copper-based, aluminum-based,  ceramic-based).
 ● We have a professional quality management team to implement total quality management such as prenatal planning,  process monitoring, continuous improvement and standardization.
 ● Our factories have independent physical laboratories, chemical laboratories, 
configuration group testing center, the introduction of a set of high standards, 
high-precision, modern testing equipment and instrumentation system, the full 
implementation of process parameters monitoring, reliability analysis, process 
research .
 
2. Received certification
 
Product Certification: UL, CQC
Management System Certification: ISO9001, TS16949, TL9000, QC080000, GJB 9001, 
IS014001, OHSAS18000
 
3. Process capability
 
The highest number of conventional board (L):  64  ;
HDI board the highest level (L):  32  ;
HDI board buildup: first-order, second-order laminated hole, second-order Staggered 
Blind hole, third-order laminated hole, third-order Staggered Blind hole ;
Special process capability: VOP (buried hole with resin plug hole) ;
The largest single size (MM): 1100 × 650
The smallest single size (MM): 50 × 50
The maximum product thickness (MM): 10.0
Minimum product thickness (MM): 0.2
Maximum copper thickness (OZ): 12
Conventional board minimum line width (MM): 0.075
Conventional board Minimum line spacing (MM): 0.075
HDI minimum line width (MM): 0.04
HDI minimum line pitch (MM): 0.05
Minimum mechanical drilling aperture (MM): 0.15
Minimum laser drilling aperture (MM): 0.076
Impedance tolerance:  ± 5% , ± 10%
Surface treatment: Full board OSP, Full board Immersion gold, OSP + Immersion gold, 
OSP + Carbon oil, Electro gold finger, OSP + Electro gold finger, Immersion gold + Electro gold finger, Lead-free spray tin, lead spray tin, Shen tin, Shen silver
 
4. Delivered
 
Fast board delivery capacity:
 
Conventional board:
 
2 layers 4-5 days delivery
4 floors 5-6 days delivery
6th floor 6-7 days delivery
8th floor 8-9 days delivery
10 layers 9-11 days delivery
12th floor 10-12 days delivery
 
HDI board:
 
High-frequency special board:
 
2 floors up to 2 days delivery
4 layers of mixed board delivery as fast as 5 days
6-8 layer mixed board delivery as fast as 7 days
 
Delivery note:
 
    The area is the area when the lot order quantity is converted out ≤0.5 square meters;
    Standard materials for the ordinary FR4 category;
    Standard thickness is 0.4mm-2.0mm;
    Standard copper thickness of 12um-35um (converted to 1/3 OZ-1 OZ);
    Conventional board standard copper thick line width and line spacing ≥ 0.1mm, 
HDI board standard copper thick line width and line spacing ≥ 0.05mm;
    Surface treatment type OSP, nickel-immersion gold, OSP + nickel-nickel alloy, lead-free spray tin, lead spray tin;
    Delivery date to confirm the completion of EQ, there are materials in stock;
    Mass production delivery days have the difference between the peak season, the 
off-season delivery period shorter than the peak season;
    Special materials, special process delivery cycle, please contact customer service staff;
    Beyond the normal delivery cycle needs, please consult customer service.
 
 
5. Service Features
 
 ● professional Allegro, fast sample production department
 ● process, delivery evaluation within 2 hours to complete
 ● expedited orders 24 hours a dedicated full-time follow-up production

 

 

 

 


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