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ROGERS, Microware Radio Frequency Board


8-Layers Blind-buried holes Hybrid high board
Brand: Type:High Frequency PCB Model: HDI-P8I0900012A0 Release Date: 2025-05-19
Applicable industries:

Specifications
Layer count:  8
Board thickness:  2.2mm
Base materials:   Rogers5880+S1000-2
Finished size:      72×50mm/1pcs
Surface finish:      Immersion Gold
Line width/line space:   10/10mil
Minimum hole:   0.15mm
Solder resist color:   Sensitive green
Cu thickness:  inner layer 1oz, outer layer 1.5oz

 

Product name: 
Hybrid high board

 

Characteristic
1. The use of S1000-2 Rogers5880+FR4 plate mixed laminated production, Rogers5880 is a very expensive ceramic plate; in which L1-L2-L3-L4 is Rogers5880 material;
2. Blind and buried hole design, L1-L2 L1-L4, L5-L8, blind, blind L3-L4;
3. The resin filling process;
4. Metal plate edge wrapping.

 

Kelly Ho / Sales Engineer 
KINGFORD ELECTRONICS CO., LTD   
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