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Metal Core PCB Capability

◆ Metal Core PCB Capability◆

No	Content	Capability
1	Board Classification	Aluminum Base, Copper Base, Iron/Steel Base, Ceramic Base,
2	Material	Domestic and Imported material
3	Surface treatment	OSP, HASL, Immersion Tin, ENIG, Immersion Silver
4	Layer account	Single / double / 4 layer
5	Max. Board Size	1500*500mm
6	Min. Board Size	5x5mm
7	Line Width/Space	0.1mm/0.1mm
8	Warp and Twist	<=0.5%
9	Board thickness	0.3-5mm
10	Copper foil thickness	35um, 70um, 105um, 140um
11	Tolerance	CNC routing: +/-0.1mm, Punch: +/-0.1mm
12	V-CUT registration	+/-0.15mm
13	Hole wall copper thickness	20-25um
14	Min. registration of hole position (compare with CAD data)	+/-3mil (+/-0.076mm)
15	Min. Punching hole	Board thickness below 1.0mm, 1.0mm
16	Min. Punching Square slot	Board thickness below 1.0mm, 1.0×1.0mm
17	Registration of printed circuit	+/-0.076mm
18	Min. drill hole diameter	0.6mm
19	Thickness of surface treatment	Plating Gold: Ni 4-6um, Au 0.1-0.5um ENIG: Ni 5-6um, Au 0.0254-0.127um Plating Silver: Ag 5-8um HASL: 10-100um
20	V-CUT degree tolerance	+/-5 degree
21	V-CUT board thickness	0.6-3.2mm
22	Min. Legend width	0.15mm
23	Min. Solder mask opening	0.1mm